English Content Archive - Seite 2 von 18

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[ 25. September 2026 ] Aumovio: Halbtrockenes Bremssystem für Volkswagens „Mission Efficiency“ Branchen-News
[ 24. September 2026 ] Emerson: Testarchitektur für Automotive-Display- und Kameraschnittstellen News
[ 24. September 2026 ] „The Autonomous“ wird unabhängiger Verein Branchen-News
[ 24. September 2026 ] Vector und Infineon: Offene HAL-Spezifikation für kleine Mikrocontroller News
[ 23. September 2026 ] Erster Design-Win für Alloy Kore Branchen-News
[ 23. September 2026 ] Bourns: Mehr Optionen bei Strommesswiderständen für Hochstrom-Anwendungen News
[ 23. September 2026 ] Alps Alpine: 12-mm-SMD-Encoder News
[ 22. September 2026 ] ZF Lifetec: Integrierte Insassenerkennungs- und Insassenschutzlösung News
[ 22. September 2026 ] Yokogawa: AC/DC-Split-Core-Stromwandler News
[ 21. September 2026 ] BlueBinaries übernimmt Automotive Testing Business von MicroNova Branchen-News

Keysight EV Summit Explores the Future of High-Power Charging

5. August 2026

The Keysight EV Summit offers a regionally focused technical program and a platform for dialogue among automakers, charging infrastructure operators, and energy providers.

[…]

Qualcomm Reorganizes Leadership in the EMEA Region

5. August 2026

Qualcomm has appointed Wassim Chourbaji as President for Europe, the Middle East, and Africa.

[…]

Qualcomm and Wayve: Pre-integrated AI Platform for Automated Driving

5. August 2026

Qualcomm and Wayve are integrating the Wayve AI Driver into the Snapdragon Ride platform, creating a production-ready end-to-end AI solution for ADAS and automated driving.

[…]

BMW is relying on NXP’s UWB platform for future safety features

4. August 2026

NXP is supplying its Trimension NCJ29D6 UWB solution for select BMW vehicles from the 2026 model year. The chip combines a digital key and short-range radar on a single hardware platform.

[…]

NXP: AM/FM Radio, Audio DSP, and AI-Powered Signal Processing on a Single Chip

4. August 2026

The module integrates AM/FM radio, audio DSP, and neural network processing to reduce system complexity and support software-defined infotainment platforms.

[…]

Bosch: New Leadership for the Power Semiconductors and Modules Business Unit

4. August 2026

Ralf Bornefeld is transitioning to an advisory role and will retire at the end of the year.

[…]

MathWorks integrates Lauterbach TRACE32 into Polyspace

4. August 2026

Developers can perform tests and code analyses in a unified environment, thereby reducing the effort required to verify safety-critical embedded software.

[…]

Rohm: An online platform for technical exchange among engineers

4. August 2026

With its new Engineer Social Hub, Rohm Semiconductor provides engineers with an online platform featuring FAQs, discussion forums, a chatbot, and direct access to experts.

[…]

dSPACE: Simulation Models for Two-Wheeler Development

3. August 2026

The solution supports the development and validation of stability and driver-assistance systems, as well as powertrains.

[…]

ELIV 2026: Conference Program Released

3. August 2026

Highlights of the program include the Automotive Trend Sessions “India – Tech & Market” and “Automotive AI,” which explore technological developments and international market trends.

[…]

AEEmobility

Der Information Hub für Automobilelektronikentwickler

English Content

Selected content of AEEmobility in English

Keysight EV Summit Explores the Future of High-Power Charging

Qualcomm Reorganizes Leadership in the EMEA Region

Qualcomm and Wayve: Pre-integrated AI Platform for Automated Driving

BMW is relying on NXP’s UWB platform for future safety features

NXP: AM/FM Radio, Audio DSP, and AI-Powered Signal Processing on a Single Chip

Bosch: New Leadership for the Power Semiconductors and Modules Business Unit

MathWorks integrates Lauterbach TRACE32 into Polyspace

Rohm: An online platform for technical exchange among engineers

dSPACE: Simulation Models for Two-Wheeler Development

ELIV 2026: Conference Program Released