In the Chiplet4Future research project, the Fraunhofer Institute for Integrated Circuits IIS in Dresden is investigating how chiplet-based architectures can be implemented in real-world electronic systems and evaluated under practical conditions. The focus is on an automotive demonstrator that integrates several functionally specialized chiplets into a single system network.
The demonstrator is based on a custom-developed substrate that provides mechanical stability and electrical interconnect structures. It serves as a central integration platform for heterogeneous chiplet systems and enables the analysis of their interactions at the system level. The Bunch-of-Wires (BoW) interface is used for communication between the chiplets. It supports high-density, scalable data transmission and meets the requirements of data-intensive applications such as advanced driver-assistance systems (ADAS).
The research platform enables the systematic investigation of communication and interconnect architectures, the behavior of heterogeneous multi-chiplet systems, and the requirements for substrate and packaging technologies. At the same time, it offers the opportunity to evaluate the integration of specialized chiplets in a realistic hardware environment. The project is thus intended to provide important insights for the development of high-performance, modular semiconductor platforms for the next generation of vehicles. (oe)
