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Porsche uses mobile app to support test drives through edge AI-based evaluation and central data interface between vehicle and cloud.

Rohm: EROM models for additional shunt resistors for thermal simulation

Rohm provides embeddable BCI ROM models of shunt resistors for rapid thermal simulation on its website.

Vector: HIL testing with up to 3.84 MW charging power

The vCTS.performance offers comprehensive HIL system tests to ensure the conformity and interoperability of charging communication between EVs and EVSEs. The system delivers scalable DC charging power of up to 3.84 MW and enables load and endurance tests under real-world conditions.

Keysight: Successful interoperability testing of eCall systems

The combined solution validates NG-eCall over 4G/5G as well as fallbacks to 2G/3G and complies with upcoming standards such as EN 17240:2024 and GB 45672-2025.

Akkodis study: AI increases productivity – but scaling remains a key ROI hurdle

19. November 2025

The new study „The capability curve: Building the next generation digital enterprise“ by Akkodis shows how companies can reconcile the growing confidence of their employees with the caution of many managers.

Inova Semiconductor: First test chip from APXpress

17. November 2025

APXpress is designed for zonal and software-defined vehicle architectures and supports data rates up to 32 Gb/s with deterministic transmission.

Keysight: Test solution for nGBASE-AU

The AE6980T test system is a platform for qualifying next-generation automotive Ethernet PHYs in accordance with the IEEE 802.3cz standard.

ISELED 2.0: Intelligent LED technology for the next generation of vehicles

ISELED 2.0 offers new features such as connection to the ILaS network, compact system-in-package solutions, and expanded applications ranging from ambient lighting to safety-related lighting functions.

IPG Automotive bundles hardware portfolio in new product line

The system is based on the CompactPCI Serial industry standard and offers a freely configurable combination of various single-board computers, modules, carrier boards, and housings. The platform provides high computing power for model parallelization, short IO access times, and broadband data interfaces.

NXP: BMS chipset with integrated EIS technology

Battery management chipset with integrated electrochemical impedance spectroscopy (EIS) enables precise, hardware-based synchronization of all battery cell measurements within a single high-voltage battery pack.