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[ 5. Dezember 2025 ] Volkswagen: Gläserne Manufaktur wird zum Innovationscampus Branchen-News
[ 4. Dezember 2025 ] KBA: BEV überholen im November Plug-In-Hybride bei Neuzulassungen Branchen-News
[ 4. Dezember 2025 ] Vector: Version 24 des Kalibrierungstools CANape News
[ 4. Dezember 2025 ] Quintauris: RT-Europa-Plattform mit Microsar-Classic-Stack News
[ 3. Dezember 2025 ] dSPACE: Übernahme von dissecto Branchen-News
[ 3. Dezember 2025 ] IPG: Partnerschaft mit b-plus Branchen-News
[ 3. Dezember 2025 ] Infineon: ITC bestätigt Patentrechtsverletzung Branchen-News
[ 2. Dezember 2025 ] Synopsys und NVIDIA integrieren KI- und GPU-Computing mit Engineeringlösungen Branchen-News
[ 2. Dezember 2025 ] TTTech Auto: Vertiefte Kooperation mit koranischem OEM Branchen-News
[ 2. Dezember 2025 ] Webasto: Heiz-Kühl-System für Innenraum und Batterie News

Vector: Creating CAPL scripts with AI

27. November 2025

With the CAPL AI Assistant, Vector is taking another step toward AI-supported development tools and inviting the professional community to actively help shape the next generation of CAPL support.

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Mercedes-Benz Trucks: New „Safety Truck“ based on the eActros 600

25. November 2025

With its new Safety Truck based on the eActros 600, Mercedes-Benz Trucks is presenting a wide range of advanced assistance and safety systems that in some cases significantly exceed current GSR requirements.

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Quintauris and IAR launch partnership for secure RISC-V software

25. November 2025

Both companies are combining their technologies to provide a powerful and security-focused RISC-V development environment for automotive real-time applications.

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IPG Automotive: Faster development with CarMaker 15.0

25. November 2025

The new version improves virtual vehicle development through optimized integration of virtual control units for early software and system testing, while also expanding ADAS/AV and endurance testing capabilities.

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Cell phone as an assistant during test drives

25. November 2025

Porsche uses mobile app to support test drives through edge AI-based evaluation and central data interface between vehicle and cloud.

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Rohm: EROM models for additional shunt resistors for thermal simulation

25. November 2025

Rohm provides embeddable BCI ROM models of shunt resistors for rapid thermal simulation on its website.

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Vector: HIL testing with up to 3.84 MW charging power

25. November 2025

The vCTS.performance offers comprehensive HIL system tests to ensure the conformity and interoperability of charging communication between EVs and EVSEs. The system delivers scalable DC charging power of up to 3.84 MW and enables load and endurance tests under real-world conditions.

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Keysight: Successful interoperability testing of eCall systems

25. November 2025

The combined solution validates NG-eCall over 4G/5G as well as fallbacks to 2G/3G and complies with upcoming standards such as EN 17240:2024 and GB 45672-2025.

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Akkodis study: AI increases productivity – but scaling remains a key ROI hurdle

19. November 2025

The new study „The capability curve: Building the next generation digital enterprise“ by Akkodis shows how companies can reconcile the growing confidence of their employees with the caution of many managers.

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Inova Semiconductor: First test chip from APXpress

17. November 2025

APXpress is designed for zonal and software-defined vehicle architectures and supports data rates up to 32 Gb/s with deterministic transmission.

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AEEmobility

Der Information Hub für Automobilelektronikentwickler

English Content

Selected content of AEEmobility in English

Vector: Creating CAPL scripts with AI

Mercedes-Benz Trucks: New „Safety Truck“ based on the eActros 600

Quintauris and IAR launch partnership for secure RISC-V software

IPG Automotive: Faster development with CarMaker 15.0

Cell phone as an assistant during test drives

Rohm: EROM models for additional shunt resistors for thermal simulation

Vector: HIL testing with up to 3.84 MW charging power

Keysight: Successful interoperability testing of eCall systems

Akkodis study: AI increases productivity – but scaling remains a key ROI hurdle

Inova Semiconductor: First test chip from APXpress